2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) 2016
DOI: 10.1109/eptc.2016.7861524
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Reliability evaluation of copper (Cu) through-silicon via (TSV) barrier and dielectric liner by electrical characterization

Jiawei Marvin Chan
1
,
Xu Chen
2
,
Kheng Chooi Lee
3
et al.
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Cited by 4 publications
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References 16 publications
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Reliability Evaluation of Copper (Cu) Through-Silicon Vias (TSV) Barrier and Dielectric Liner by Electrical Characterization and Physical Failure Analysis (PFA)

Chan
1
,
Chen
2
,
Lee
3
et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
9
0
2
0
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Reliability Evaluation of Copper (Cu) Through-Silicon Vias (TSV) Barrier and Dielectric Liner by Electrical Characterization and Physical Failure Analysis (PFA)

Chan
1
,
Chen
2
,
Lee
3
et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
9
0
2
0
View full textAdd to dashboardCite

Observations of copper (Cu) transport in through-silicon vias (TSV) structure by electrical characterization for its reliability evaluation

Chan
1
,
Tan
2
,
Lee
3
et al. 2017
2017 IEEE International Reliability Physics Symposium (IRPS)
4
0
0
0
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3D-PIM NoCs with Multiple Subnetworks: A Performance and Power Evaluation

Badawy
1
,
Gardea
2
,
Yan3
et al. 2018
2018 IEEE 37th International Performance Computing and Communications Conference (IPCCC)
0
0
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0
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