2016 6th Electronic System-Integration Technology Conference (ESTC) 2016
DOI: 10.1109/estc.2016.7764458
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Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling

Bernhard Wunderle
1
,
T. Onken
2
,
Jens Heilmann
3
et al.
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Cited by 8 publications
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References 28 publications
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Accelerated Vibrational Fatigue Testing of Thin Aluminum and Copper Films at Different Temperatures

Osipova
1
,
Wunderle
2
,
Arnold
3
et al. 2018
2018 7th Electronic System-Integration Technology Conference (ESTC)
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Accelerated Vibrational Fatigue Testing of Thin Aluminum and Copper Films at Different Temperatures

Osipova
1
,
Wunderle
2
,
Arnold
3
et al. 2018
2018 7th Electronic System-Integration Technology Conference (ESTC)
8
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0
0
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Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion

Breitenreiner
1
,
Pflügler
2
,
Pufall
3
et al. 2022
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilever

Jöhrmann
1
,
Stöckel
2
,
Wunderle
3
2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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