Reliability of Thermal Interface Materials in Combined Mechanical and Thermal Stress

Berry, Danielle R.; Valenzuela, Stephanie A.; Sootsman, Joseph R.

doi:10.1109/itherm55368.2023.10177530

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Reliability of Thermal Interface Materials in Combined Mechanical and Thermal Stress

Cited by 2 publications

References 12 publications

Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

Thermal Interface Material Analyzer Test Method Development for Gap Fillers: Simultaneous Thermal and Mechanical Stress Cycling

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