Reply to “Comment on ‘A Compact Analytic Model of the Strain Field Induced by Through ilicon Vias”’

Abstract

The comment adds the results of 2×2 TSVs which is an extension of our 2-TSV case, and the clarification of no thermal strain effect on mobility. There are no contradictions with our original paper at all. Note that for the mobility calculation, the temperature dependence can be considered by the band parameters and phonon scattering [1].There is a more sophisticated point suggested coauthor Prof. Goldstein. It is stated in the presented comment that "the stress is not affected by the thermal strains." Indeed, stresses depend explicitly on elastic strains only. Nevertheless, there is implicit dependence of stresses on thermal strains coming from the dependence of