Research on board-level thermal dissipation of the mini LED in COB packaging

Abstract

In view of the high Thermal Flux Density encountered with the Mini LED in COB (Chip on Board) packaging, board-level thermal dissipation is becoming more and more important. This paper analyses characteristics and trends of board-level thermal dissipation of the Mini LED. First, board-level materials are developing from the ordinary PCB (Printed Circuit Board) to metallic materials and ceramic materials. Second, the limitation of process technologies and material costs make thermal dissipation of hybrid substrates the future direction for development. In order to meet the requirements of thermal dissipation for different power devices and products, optimization design and simulation analysis of the thermal dissipation structure becomes a real necessity. Therefore, digitalized thermal simulation design and accurate thermal simulation design become a practical necessity. Finally, the reliability and the interface crack of a large number of micro pores caused by Mini LED board-level thermal dissipation are analyzed. To ensure the massive production of the Mini LED, the process level and the quality control of the entire manufacturing process must be improved.