Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure

Gu, Tingwei; Liu, Ning; Feng, Zhengsen; Sun, Xiaodong; Meng, Xiangdong

doi:10.1016/j.microrel.2024.115545

Microelectronics Reliability

2024

DOI: 10.1016/j.microrel.2024.115545

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Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure

Tingwei Gu,

Ning Liu,

Zhengsen Feng

et al.

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Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure

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References 20 publications

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