Research on The Bonding Properties of Vitrified Bonds With Porous Diamonds and The Grinding Performance of Porous Diamond Abrasive Tools

Abstract

Ordinary diamond presents the disadvantages of poor self-sharpening and concentrated grinding stress when it is used as an abrasive. Moreover, this kind of diamond cannot be well wetted by the vitrified bond, resulting in a lower holding force of the binder to the abrasives (i.e., the diamond is easy to detach from the binder matrix during grinding). These comprehensive factors not only reduce the surface quality of the processed workpiece, but also hinder the processing efficiency. In order to solve these problems, a new type of porous diamond with high self-sharpening properties was prepared using a thermochemical corrosion method in this study. Our results showed a great improvement in pore volume and specific surface area of the porous diamond compared with ordinary diamond abrasive particles, and the holding force and wettability of vitrified bond to the porous diamond abrasive particles were also improved. Compared with ordinary diamond abrasive tools, porous diamond abrasive tools showed a 29.6% increase in grinding efficiency, a 15.5% decreased in grinding ratio, a 27.5% reduction in workpiece surface roughness, and the scratches on the silicon wafer surface were reduced and refined.