Research Progress of Ceramic Metallization Technology

Abstract

Due to the wide application of ceramics in electronic device packaging, the performance of ceramic metallization layer directly determines the performance of the whole package device. This paper introduces the main preparation methods of ceramic metallization, discusses the influence of Mo powder size, metallization formula, sintering temperature and other factors on the performance of ceramic metallization layer prepared by activated Mo-Mn method, and introduces several kinds of methods that can be tested to test the performance of ceramic metallized sealing samples. A new research direction of Ceramic Metallization Technology in the advanced field is put forward.