Research Progress of Electroplated Micropore for Interconnection Technology

Sun, Zhaoqing; He, Gang; Zhao, Zhigang; He, X. T.; Zhao, Hang

doi:10.1088/1742-6596/2430/1/012011

Cited by 4 publications

(1 citation statement)

References 16 publications

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“…[1][2][3][4][5][6]. Due to this reason, copper electrodeposited layers find numerous applications in nano-and micro-electronics [7], as well as as a decorative and protective layer [8]. To control the nano-and microstructure of the deposited copper layer, functional organic additives such as Cl − [9][10][11], MPS/SPS [2,[12][13][14][15][16], and PEG [17][18][19] are used.…”

Section: Introductionmentioning

confidence: 99%

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Mroczka

Słodkowska

2023

Molecules

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Benzotriazole (BTA) is an important compound that demonstrates the strongest anticorrosion properties of copper and plays a role as a leveler and an additive to the electroplating bath for control of the roughness and corrosion resistance of the electrodeposited copper layer. In this paper, we combined cyclic voltammetry (CV), time-of-flight secondary-ion mass spectrometry (TOF-SIMS), surface enhanced Raman spectroscopy (SERS), and atomic force microscopy (AFM) to study the interaction of BTA with copper surfaces at varied concentrations with and without the presence of chloride ions. We identified the most relevant molecular copper and its complex forms with BTA on the copper electrodeposited layer. BTA is adsorbed and incorporated into the copper surface in monomeric, dimeric, trimeric, tetrameric, and pentameric forms, inhibiting the copper electrodeposition. The addition of chloride ions diminishes the inhibiting properties of BTA. The Cu-BTA-Cl complexes were identified in the forms C12H8N6Cu2Cl− and C6H4N3CuCl−. Coadsorption of chloride ions and BTA molecules depends on their concentration and applied potential. Chloride ions are replaced by BTA molecules. BTA and chloride ions, depending on their concentration and applied potential, control the copper nucleation processes at the micro- and nanoscales. We compared the abilities and limitations of TOF-SIMS and SERS for studies of the interactions of benzotriazole with copper and chloride ions at the molecular level.

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Section: Introductionmentioning

confidence: 99%

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Mroczka

Słodkowska

2023

Molecules

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Clarifying the mechanism of actions of suppressor, brightener and sodium chloride in acid copper electrodeposition: A multidisciplinary approach for a many variable problem

Biffoli,

Cartechini,

Riccardi

et al. 2024

Journal of Electroanalytical Chemistry

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Improved Voltammetric Procedure for Chloride Determination in Highly Acidic Media

Maciąg,

Hyk,

Ratajczyk

et al. 2024

Materials

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Cyclic voltammetry (CV) can be applied as a reliable method for the determination of chloride ions in a range from several to a couple hundred (about 200) ppm. Since the standard potential of chloride ion/gaseous chlorine is 1.36 V vs. normal hydrogen electrode (NHE), the efficient oxidation of Cl− ion occurs at very positive electrode potentials, usually higher than +1.7 V vs. NHE. It is possible to observe this phenomenon only at noble-metal or inert carbon electrodes. Many other solutes, usually organic compounds, are often oxidized at this potential. This is the reason why the determination of Cl− content directly from an increase in the oxidation current is not reliable and could lead to overestimated values. However, gaseous chlorine, generated at a positive potential dissolve in the analyzed solution, could be reduced in the reverse scan of a cyclic voltammetric curve. Optimization of the experimental procedure using statistical tools enables the development of an improved method for the direct quantification of chloride ions in acid copper electroplating baths. Under the proposed experimental conditions, the calibration curve (Cl2 voltammetric reduction current vs. chloride ions concentration) is represented by the linear model for the concentration of chlorides ranging from 10 to 200 mg/dm3. The developed method for analyzing chloride ions in an acid sulfate electroplating copper bath has many unique properties. It is fast; the time of a single analysis is less than 20 min. In automatic mode, it can be repeated up to 50 times a day. The method does not require processing of the sample of the analyzed bath before measurement. As a result, no additional chemical reagents are used, and the test sample can be returned to the plating bath.

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Research Progress of Electroplated Micropore for Interconnection Technology

Cited by 4 publications

References 16 publications

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Clarifying the mechanism of actions of suppressor, brightener and sodium chloride in acid copper electrodeposition: A multidisciplinary approach for a many variable problem

Improved Voltammetric Procedure for Chloride Determination in Highly Acidic Media

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