bilayer structures, fabricated by atomic layer deposition at 200°C and post-deposition annealing, were studied in Pt bottom electrode (Pt-BE)/insulator/Pt top electrode (Pt-TE) capacitors. The Pt-BE/ Al 2 O 3 /TiO 2 /Pt-TE capacitor exhibits stable bipolar resistive switching with an on-resistance/off-resistance ratio of >10 2 controlled by a small voltage of +0.8 V. The forming process occurs in two steps of breaking of the Al 2 O 3 layer and transfer of oxygen vacancies (V O ) into the TiO 2 layer. The capacitor showed poor endurance, particularly in the high-resistance state under vacuum conditions. This indicates that the insulating TiO 2 layer without V O is not formed near the Al 2 O 3 layer because oxygen cannot be introduced from the exterior. On the other hand, in the Pt-BE/TiO 2 / Al 2 O 3 /Pt-TE capacitor, multilevel resistive switching with several applied voltage-dependent nonvolatile states is observed. The switching mechanism corresponds to the Al 2 O 3 layer's trapped V O concentration, which is controlled by varying the applied voltage.