Return Loss of Three Types of Arching Bond Wire Structures for RF and Microwave Circuit Applications

Abstract

The S-parameters of a gold wire bonded in air to two microstrip lines are validated by measurements and HFSS software simulations at frequencies 0.04~6 GHz. From simulation results and measurement data, it is found that an arching bond wire with smaller arc angle can minimize the return loss. From simulations, it is also found that the return loss can be improved and operation frequency shifts can be achieved by using multiple wires placed in parallel in bond wire arrays.