Revealing Interfacial Structures between Silica and Epoxy Adhesive via Spectroscopy and Morphological and Adhesion Tests
Shuai Zhang,
Jingxue Zhang,
Chenghong Ding
et al.
Abstract:Adhesives and glass are commonly used in electronic packaging. The macroscopic and microscopic (molecular-level) structures at the interface between glass and epoxy adhesives have attracted a great deal of interest in the field of surface analysis. In many previous studies, sum frequency generation vibration spectroscopy (SFG-VS) with a total internal reflection (TIR) silica prism was used to probe these types of interfaces. However, for adhesives with relatively high refractive indexes, the requirement of a T… Show more
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