Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Abstract

Electrochemical migration (ECM) is one of the serious failure modes encountered in electronic devices due to the electrochemical reactions triggered by the presence of moisture and bias voltage, leading to the growth of dendrites and short circuits. The classical ECM mechanism consists of four consecutive stages: (i) electrolyte formation, (ii) anodic dissolution, (iii) ion transport, and (iv) dendrite growth. ECM is a delicate process that involves a combination of a good number of factors, such as the electrode properties, climatic conditions, contaminants, electric field, additives, etc. We intend to provide a comprehensive review of the complex effects that these factors have on each stage of ECM and provide insights into the recent developments in ECM research. Previous findings, current debates and recent discoveries are covered in this article. This review paper also provides a review of recent strategies for ameliorating ECM failures in electronics.

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“…2g), indicating the combined effect of PVP and Br − for controlling the morphology structure of AgNWs. 36 The results are consistent with that in Fig. 1.…”

Sulphur related Corrosion in Power Modules and its Impact on the Switching Performance

“…The material composition (especially the metal concentration) of the dendritic structures have a significant influence on the conductivity and the chance of a breakdown event is higher in the presence of humidity [8]. This leads to another approach in measuring the blocking voltage, again after a soaking experiment under high relative humidity.…”

“…In general, Cu2O-dendrites on DBC-substrates covered with Si-gel are not reported as long as the adhesion is intact. Therefore, a classical ECM like described in [8] cannot explain the structure, because the Cu-ion itself is unable to reach the cathode to form a dendrite. Nevertheless, this secondary structure at the cathode is present after a short exposure to high relative humidity and high H2Sconcentrations.…”