2024
DOI: 10.1149/2162-8777/ad8519
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Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

T. Wernicke,
B. Rebhan,
V. Vuorinen
et al.

Abstract: An overview of various low-temperature (<200°C) wafer bonding processes using metal interlayers is presented. Such processes are very attractive for novel applications in 3D heterogenous packaging as the allow for simultaneous formation of electrical interconnects, as well as hermetic encapsulation of various sensors and microelectromechanical systems-based devices. Metal wafer bonding is a generic category of processes consisting of various sub-categories, each one defined by the different principles gover… Show more

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