RF characterization of coplanar waveguide (CPW) transmission lines on single-crystalline diamond platform for integrated high power RF electronic systems

He, Yingdong; Becker, Michael F.; Grotjohn, T.A.; Hardy, Aaron; Muehle, Matthias; Schuelke, Thomas; Papapolymerou, John

doi:10.1109/mwsym.2017.8058613

Cited by 5 publications

(3 citation statements)

References 6 publications

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“…In this case, a polyimide ink was deposited as the dielectric alongside the silver to produce multilayer devices. Further work investigated single layer, radiofrequency waveguides on a diamond substrate [71]. Similar techniques have been used to produce other high-frequency electronic components, such as transmission lines [72] and power dividers [73].…”

Section: Antenna Waveguides and Transmission Linesmentioning

confidence: 99%

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A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing

Wilkinson

Smith

Kay

et al. 2019

Int J Adv Manuf Technol

312

235

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Aerosol Jet Printing (AJP) is an emerging contactless direct write approach aimed at the production of fine features on a wide range of substrates. Originally developed for the manufacture of electronic circuitry, the technology has been explored for a range of applications, including, active and passive electronic components, actuators, sensors, as well as a variety of selective chemical and biological responses. Freeform deposition, coupled with a relatively large stand-off distance, is enabling researchers to produce devices with increased geometric complexity compared to conventional manufacturing or more commonly used direct write approaches. Wide material compatibility, high resolution and independence of orientation have provided novelty in a number of applications when AJP is conducted as a digitally driven approach for integrated manufacture. This overview of the technology will summarise the underlying principles of AJP, review applications of the technology and discuss the hurdles to more widespread industry adoption. Finally, this paper will hypothesise where gains may be realised through this assistive manufacturing process.

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Section: Antenna Waveguides and Transmission Linesmentioning

confidence: 99%

“…Similar techniques have been used to produce other high-frequency electronic components, such as transmission lines [72] and power dividers [73]. Oakley et al [74] did a direct benchmarking of AJP terahertz filters with equivalent copper filters produced using photolithographic techniques and found…”

Section: Antenna Waveguides and Transmission Linesmentioning

confidence: 99%

A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing

Wilkinson

Smith

Kay

et al. 2019

Int J Adv Manuf Technol

312

235

View full text Add to dashboard Cite

show abstract

“…The use of AJT to generate lines of silver ink is welldocumented [4,5]. Thus, on the one hand, the RF characterization of AJ printed lines is published [6][7][8][9][10] and on the other hand, the AJT has been used to connect chips [11]. Nevertheless, to the authors' knowledge, there is still no public research to connect chips to circuit boards ( Fig.…”

Section: Aerosol Jet Technologymentioning

confidence: 99%

Bare die connections via aerosol jet technology for millimeter wave applications

Rohrl

Jakob

Bogner

et al. 2019

Int. J. Microw. Wireless Technol.

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This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

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High-Power RF Characterization of Diamond Schottky Barrier Diodes at X-band

Konstantinou

Herrera-Rodriquez

Hardy

et al. 2020

2020 IEEE/MTT-S International Microwave Symposium (IMS)

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RF characterization of coplanar waveguide (CPW) transmission lines on single-crystalline diamond platform for integrated high power RF electronic systems

Cited by 5 publications

References 6 publications

A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing

A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing

Bare die connections via aerosol jet technology for millimeter wave applications

High-Power RF Characterization of Diamond Schottky Barrier Diodes at X-band

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