Robust Design of Digital Circuits on Foil

Myny, Kris; Genoe, Jan; Dehaene, Wim

doi:10.1017/cbo9781316411483

Cited by 5 publications

(1 citation statement)

References 189 publications

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“…Since only n-type transistors can be built in this technology, it is not possible to use complementary logic to construct standard cells. Therefore, a number of topologies, that originate from nMOS logic, have been suggested to realize logic gates on flex foil [MGD16]. An example of a naive topology is shown in Fig.…”

Section: Inkjet Printingmentioning

confidence: 99%

Security on Plastics: Fake or Real?

Mentens

Genoe

Vandenabeele

et al. 2019

TCHES

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Electronic devices on plastic foil, also referred to as flexible electronics, are making their way into mainstream applications. In the near future, flexible electronic labels can be embedded in smart blisters, but also used as mainstream technology for flexible medical patches. A key technology for flexible electronics is based on thin-film transistors, which have the potential to be manufactured at low cost, making them an ideal candidate for these applications. Yet, up to now, no-one is taking digital security into account in the design of flexible electronics.In this paper, we present, to our knowledge, the first cryptographic core on plastic foil. Two main research challenges arise. The first challenge is related to the reliability of the circuit, which typically decreases when the circuit area increases. By integrating cryptographic modules, we explore the limits of the technology, since the smallest lightweight block ciphers feature a larger area than the largest digital circuit on flex foil reported up to now. The second challenge is related to key hiding. The relatively large features on the chip and the fact that electronic chips on plastics are used as bare dies, i.e. they are not packaged, make it easy to read out the value of the stored secret key. Because there is no dedicated non-volatile memory technology yet, existing methods for writing data to the flexible chip after fabrication are based on wire cutting with a laser or inkjet printing. With these techniques, however, it is extremely easy to “see” the value of the secret key under a microscope. We propose a novel solution that allows us to invisibly program the key after fabrication.

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Section: Inkjet Printingmentioning

confidence: 99%

Security on Plastics: Fake or Real?

Mentens

Genoe

Vandenabeele

et al. 2019

TCHES

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Photo‐Curable Fluorinated High‐k Polyimide Dielectrics by Polar Side Substitution Effect for Low‐Voltage Operating Flexible Printed Electronics

Ye,

Kwon,

Kim

et al. 2024

Adv Funct Materials

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Polyimide‐based dielectric films are widely used in various thin film devices including organic field‐effect transistors (OFETs) owing to their promising thermal/chemical stability, mechanical flexibility, and insulating properties. On the other hand, considerable attention is paid to lowering the process temperature to allow coating on plastic substrates because high‐temperature annealing (≈200 °C) is usually required to convert precursors to polyimide films with those excellent properties. In addition, polyimide‐based dielectric films have low dielectric constants (k) (<4). Therefore, modifying the k properties of polyimide is a critical issue for applications as an insulating thin film for practical transistors. This paper reports a new type of polyimide‐based gate dielectric comprising methacryloyl moiety (PI‐MA) as a side chain for photo‐pattern/processability and high‐k properties. This study shows that the photocured PI‐MA thin films show excellent insulating properties (leakage current densities < 10−8 A cm⁻2 at 4 MV cm⁻1) and high‐k properties (≈8) even without a post‐annealing process. Finally, the use of PI‐MA in printed field‐effect transistors results in high performance with low‐voltage operation (within 5 V) and integrated logic‐gate devices (NOT, NAND, and NOR gates).

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Determination of electrical parameters of ITO/CZTS/CdS/Ag and ITO/CdS/CZTS/Ag heterojunction diodes in dark and illumination conditions

Gezgi̇n

Kılıç

2019

Opt Quant Electron

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Robust Design of Digital Circuits on Foil

Cited by 5 publications

References 189 publications

Security on Plastics: Fake or Real?

Security on Plastics: Fake or Real?

Photo‐Curable Fluorinated High‐k Polyimide Dielectrics by Polar Side Substitution Effect for Low‐Voltage Operating Flexible Printed Electronics

Determination of electrical parameters of ITO/CZTS/CdS/Ag and ITO/CdS/CZTS/Ag heterojunction diodes in dark and illumination conditions

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