Robust Metallic Nanolaminates Having Phonon-Glass Thermal Conductivity

Abstract

Heat transfer phenomena in multilayer structures have gained interest due to their promising use in thermal insulation and thermoelectricity applications. In such systems, nanostructuring has been used to introduce moderate interfacial density, and it has been demonstrated that interfacial thermal resistance plays a crucial role in reducing thermal conductivity κ. Nevertheless, the main constraint for actual applications is related to their tiny size because they are extremely thin to establish appreciable temperature gradients. In this work, by severe plastic deformation process of accumulative roll bonding (ARB), a 250 µm thick Cu‑Nb multilayer containing more than 8000 interfaces with periods below 40 nm was obtained, enabling the production of bulk metallic nanolaminates with ultralow κ. Multilayers present an ultralow κ of ~0.81 W/mK at 300 K, which is 100 times smaller than its Cu‑Nb bulk counterpart, and even lower than the amorphous lattice limit for the Cu‑Nb thin film system. By using electron diffusive mismatch model (EDMM), we argue that both electrons diffusively scattering at interface and those ballistically crossing the constituents are responsible for heat conduction in the Cu‑Nb multilayers at nanoscale. Hence, ARB Cu‑Nb multilayers are intriguing candidate materials which can prove avenues to achieve stable ultralow κ thermal barriers for robust applications.

Thermodynamic and Kinetic Simulations Used for the Study of the Influence of Precipitates on Thermophysical Properties in NiTiCu Alloys Obtained by Spark Plasma Sintering

“…This is mainly due to the increasing number of interfaces in a mechanically alloyed material. Moreover, when nanolamellar convoluted structures are inherited from MA during the subsequent alloy processing, this will have a strong effect on thermal conductivity [ 53 , 54 ]. This can further be correlated to the changing relative amounts of martensite phases, influenced by changing alloying and affected by complex precipitation.…”

High-Performance Nanoscale Metallic Multilayer Composites: Techniques, Mechanical Properties and Applications

“…These materials possess unusually high strength at thin layer thicknesses, making them attractive for various applications. NMMCs have been shown to have phonon-glass thermal conductivity, which makes them attractive for high-performance thermal barriers [7]. These materials can be used to make devices that require efficient heat management.…”

“…The thermal conductivity of NMMs is affected by the number of interfaces, the layer thicknesses, and the thermal conductivity of the individual materials. The thermal conductivity of NMMs is generally lower than that of the individual materials, due to the increased scattering of phonons at the interfaces [7]. For example, in the field of thermal management in nanostructures, the thermal conductivity of NMMs is critical for the design and optimization of thermal management strategies.…”

“…Also, the thermal conductivity of NMMs can affect the performance of energy storage devices, such as batteries and supercapacitors. For example, a high thermal conductivity can help to improve the heat dissipation in energy storage devices, which can help to reduce the risk of thermal failure and improve the overall performance of the device [7].…”

“…Moreover, their exceptional mechanical strength and toughness make them ideal candidates for structural components that require both high strength and ductility [4,5]. In addition to their electrical and mechanical properties, the thermal conductivity of high-performance NMMCs can be tailored to meet specific requirements [6,7]. By carefully selecting the constituent materials and layer thicknesses, it is possible to achieve either high or low thermal conductivity values.…”