2005 Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electr
DOI: 10.1109/icimw.2005.1572506
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Room Temperature Terahertz Microbolometers

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Cited by 15 publications
(6 citation statements)
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“…In addition, when THz frequencies smaller than 3 THz are being targeted, the mismatch between membrane size and wavelength will quickly degrade the published noise equivalent power (NEP) (100 pW in the 3-4 THz range). The CEA-Leti THz pixel three-dimensional [21] stack differs substantially from standard IR bolometers. The key feature of this architecture relies on the separation between the two main functions of such sensors, i.e.…”
Section: Detector Technologymentioning
confidence: 99%
“…In addition, when THz frequencies smaller than 3 THz are being targeted, the mismatch between membrane size and wavelength will quickly degrade the published noise equivalent power (NEP) (100 pW in the 3-4 THz range). The CEA-Leti THz pixel three-dimensional [21] stack differs substantially from standard IR bolometers. The key feature of this architecture relies on the separation between the two main functions of such sensors, i.e.…”
Section: Detector Technologymentioning
confidence: 99%
“…On the base of this know-how, CEA-LETI has initiated the development of dedicated 2D THz sensors based on the adaptation of IR microbolometers to the THz range. The detection principle is based on the separation between the THz radiation absorber and the thermometer: each pixel of the Focal Plane Array consists in antenna-coupled microbolometer ( [29]). The optical collection function is provided by metallic antennas processed above a buried metallic reflector to achieve a resonant cavity that favors absorption.…”
Section: Introductionmentioning
confidence: 99%
“…On the basis of its know-how in such thermal sensors and in sub-millimeter focal plane arrays (FPAs) [5], CEA-Leti has initiated a few years ago the development of fully THz customized bolometer [6]. After a research phase dedicated to model the pixel and to engineer specific technological processes, a complete program has been carried from 2008 till now.…”
Section: Introductionmentioning
confidence: 99%