Scanning Probe Microscopy – History, Background, and State of the Art

Heiderhoff, R.; Balk, L.J.

doi:10.1002/9783527641864.ch15

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2012

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“…Material properties like thermal conductivity, thermal expansion coefficient, and Young's modulus can either be taken from literature or be determined by complementary scanning probe microscopy techniques. An overview of these techniques can be found in Ref [21].…”

Section: Discussionmentioning

confidence: 99%

Advanced SEM/SPM microscopy

Heiderhoff

2012

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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Advanced SEM/SPM microscopy will expand the application fields in failure analysis and reliability investigation, because the recognition of defects and their subsequent characterization have to be carried out with highest spatial resolution to ensure that even smallest structures with modified material properties can be evaluated. Promising for future applications is the fact that the used probes simultaneously can either be used as sensors, giving access to a vast variety of material properties, or as actuators, which can deliberately modify samples properties.

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Section: Discussionmentioning

confidence: 99%