Abstract:A metallic wire mesh screen, wire diameter of approximately 50 μm, is folded into ~80 “accordion-shaped” mini-channels and placed inside the evaporator package of a novel passive thermal management device for cooling overhead light-emitting diodes (LEDs) used in factory floors and high-bay facilities. The thermal power dissipated via these devices ranges between 75 W and 171 W. The channel walls (screen) wick liquid water from the porous wick (located centrally above the screen) and facilitate its evaporation.… Show more
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