Shear adhesive strength between epoxy resin and copper surfaces: a density functional theory study

Abstract

Adhesive strength varies greatly with direction; various adhesion tests have been conducted. In this study, the shear and tensile adhesive strength of epoxy resin for copper (Cu) and copper oxide...

Molecular Understanding of Adhesion of Epoxy Resin to Graphene and Graphene Oxide Surfaces in Terms of Orbital Interactions

“…The dotted lines are calculated values, and the solid lines indicate fittings by the Morse potential. The shape of the obtained curves agrees well with those in the earlier works. ,,− The fitting parameters D e and a are listed in Table . Figure a shows that the energy at the ER/GO interface increases more rapidly than at the ER/graphene interface when the ER molecule moves farther from the surface.…”

“…Adhesion strengths for the ER/graphene and ER/GO interfaces were calculated according to the previous studies. ,,− The adhesion force was estimated by detaching the ER molecule 4 from the adherend surface in steps with an increment of 0.1 Å from 0 to 8 Å (Figures S2 and S3). In each step, a single-point calculation was performed to obtain the potential energy.…”

Elucidating the Effects of Chemisorbed Water Molecules on the Adhesive Interactions of Epoxy Resin to γ-Alumina Surfaces

“…The dissociation energy curves of the FER molecule for the four FER/alumina interfaces ( 1b , 2b , 3b , and 4b ) are shown in Figure a. These energy curves have a single inflection point, which corresponds with previous studies. ,,,− ,− The black, blue, orange, and red colors correspond with the dissociation energy curves of the FER for 1b , 2b , 3b , and 4b , wherein the points on the curves are the calculated values and the solid lines are the fitting curves for the Morse potential expressed in eq . The parameter D e of the Morse potential represents the adhesion energy, that is, the depth of the potential well, which was 3.22, 2.94, 2.30, and 2.96 eV, respectively.…”

“…The adhesion properties of epoxy resins to metal surfaces have been well studied both experimentally and theoretically. − In recent years, the combination of aluminum materials, which are light metals, and epoxy resins has been attracting attention owing to industrial demands such as the development of lightweight automobiles and highly reliable pressure sensors. , Aluminum metals can be converted into alloys to increase their strength and are used in different fields . Aluminum materials are oxidized in air, and their surfaces are generally formed of alumina (Al 2 O 3 ). , These surfaces have been investigated using scanning electron microscopy (SEM), transmission electron microscopy (TEM), nuclear magnetic resonance (NMR), and X-ray photoelectron spectroscopy (XPS) …”

Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

“…Sumiya et al studied the shear adhesion strength between epoxy resin and copper surface using density functional theory. 22 In the future, it will be necessary to conduct further theoretical analysis in addition to research on the reactivity of copper and hydroxyl groups (copper preference) and the effect of VUV light on the inside of the resin.…”