SiC high‐tech ceramics — a comparison of laser processes

Abstract

Extensive R&D applied various laser sources — from nanosecond VIS‐wavelength to femtosecond IR and water‐jet guided lasers — to enhance the quality and efficiency of laser structuring, fine cutting, and drilling of silicon carbide. Tests focused on surface roughness, cutting line precision, and high ablation rates. Challenges due to diverse material compositions, like diamond layers, required combined methods to develop viable approaches. To meet economic constraints, mechanical grinding was integrated with recurring laser processing.