2023 IEEE International 3D Systems Integration Conference (3DIC) 2023
DOI: 10.1109/3dic57175.2023.10155073
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SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications

Emre Can Durmaz
1
,
Carl Heine
2
,
Zhibo Cao
3
et al.
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