Silicon as a mechanical material

Petersen, K.

doi:10.1109/proc.1982.12331

Cited by 2,495 publications

(491 citation statements)

References 139 publications

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“…Since 1970s', people has attempted to fabricate mechanical structures through technologies originally developed for semiconductor industry [6][7][8], these attempts were finally proved to be successful. Today, silicon micromachining has evolved into a significant branch of modern manufacturing industry.…”

Section: Micro System Technology and Cmutsmentioning

confidence: 99%

Ultrasonic Transducers

2014

Ultrasonic Technology for Desiccant Regeneration

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Section: Micro System Technology and Cmutsmentioning

confidence: 99%

Ultrasonic Transducers

2014

Ultrasonic Technology for Desiccant Regeneration

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“…Consider a silicon lever with dimensions 2 x 2 x 0.1 Jl.m, which could be manufactured by techniques used for integrated circuits [13]. This lever has the same force constant as the larger tungsten lever but a resonant frequency of 37 MHz.…”

Section: Theorymentioning

confidence: 99%

Atomic Force Microscopy: General Principles and a New Implementation

McClelland

Erlandsson

Chiang

1987

Review of Progress in Quantitative Nondestructive Evaluation

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“…This is due to a combination of the excellent mechanical and micromachining properties of silicon [6] and maturity of the associated processing techniques [7]. In addition, the use of silicon allows for application of the lines to the rapidly advancing field of RF MEMS [8,9], which is also predominantly based on silicon technologies.…”

Section: Introductionmentioning

confidence: 99%

Design and Simulation of Membrane Supported Transmission Lines for Interconnects in a Mm-Wave Multichip Module

Farrington¹,

Iezekiel²

2011

PIER B

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Abstract-Investigations are conducted into low-loss, low-dispersion fully shielded membrane-supported striplines designed for use in a millimeter-wave multi-chip-module. Two types of transmission line are studied: a membrane-supported shielded stripline and a novel variation of this where the membrane material is removed in areas of little mechanical importance to reduce attenuation and dispersion. The latter is possible through the exploitation of a versatile micromachining technique using SU-8 for both the membrane and the shielding. The micromachining techniques used for the fabrication of the microshielding allows for the conformal packaging of lines and devices, with the ultimate aim of the realization of novel components for 3D system-in-a-package type modules. Extensive simulated results obtained from rigorous electromagnetic modeling are presented that fully characterize both types of line and, where possible, are compared to measured results. Loss mechanisms are investigated for both line types and simulations suggest that losses as low as 0.39 dB/cm and effective relative permittivities of less than 1.05 are possible at a frequency of 100 GHz, comparing well with other demonstrated membrane supported transmission lines. The methods used for investigation of line characteristics and analysis of single-mode, nonleaky frequency range are applicable to any variety of membrane supported transmission line. The basics of line fabrication are given along with measurement results and de-embedding techniques used at V-band.

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Silicon as a mechanical material

Cited by 2,495 publications

References 139 publications

Ultrasonic Transducers

Ultrasonic Transducers

Atomic Force Microscopy: General Principles and a New Implementation

Design and Simulation of Membrane Supported Transmission Lines for Interconnects in a Mm-Wave Multichip Module

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