Silicon-Based Micromachining Process for Flexible Electronics

Abstract

In this chapter, we introduce silicon-based micromachining process and devices for flexible electronics application. Silicon-based flexible electronics have the unique advantage over other polymer-based process that leverage the traditional standard CMOS process and can be integrated with scalable IC technology. While integrating with CMOS process, special considerations must be taken into account, such as release process, transfer process, and process integration, in order to produce siliconbased flexible electronics. Several efforts and process developments will be illustrated in this chapter with the highlights of imager and wearable electronics application.