Silicon sensor prototypes for the Phase II upgrade of the CMS tracker

Bergauer, T.

doi:10.1016/j.nima.2016.03.019

Cited by 4 publications

(3 citation statements)

References 3 publications

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“…The wafers processed by IFX [3] are made of float-zone silicon (FZ) that is physically thinned to 200 µm. The bulk material of all samples is p-doped silicon while the strip and bias ring implants are n-doped [4], referred to as n-in-p. The edge implant on the front-side as well as the backplane implant are p-doped.…”

Section: Experimental Setup and Simulation Environmentmentioning

confidence: 99%

Front-side biasing of n-in-p silicon strip detectors

Baselga¹,

Bergauer²,

Dierlamm³

et al. 2018

J. Inst.

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Front-side biasing is an alternative method to bias a silicon sensor. Instead of directly applying high voltage to the backside, one can exploit the conductive properties of the edge region to bias a detector exclusively via front-side connections. This option can be beneficial for the detector design and might help to facilitate the assembly process of modules. The effective bias voltage is affected by the resistance of the edge region and the sensor current. The measurements of n-in-p sensors performed to qualify this concept have shown that the voltage drop emerging from this resistance is negligible before irradiation. After irradiation, however, the resistivity of the edge region increases with fluence and saturates in the region of 107 Ω cm at fluences above 6 ⋅ 1014 neqcm−2 and an operation temperature of −20 ̂C. The measurements are complemented by TCAD simulations and interpretations of the observed effects.

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Section: Experimental Setup and Simulation Environmentmentioning

confidence: 99%

Front-side biasing of n-in-p silicon strip detectors

Baselga¹,

Bergauer²,

Dierlamm³

et al. 2018

J. Inst.

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“…The measured current-voltage characteristics (IV) and capacitance-voltage characteristics (CV) of sensors of HPK can be found in [4]. The sensors exhibit a full depletion voltage of ∼ 200 V, are stable up to 1 kV and show very low dark currents in general.…”

Section: Global Parametersmentioning

confidence: 99%

Exploring the quality of latest sensor prototypes for the CMS Tracker Phase II Upgrade

König

2017

Nuclear Instruments and Methods in Physics Research Section A:

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The LHC at CERN will reach its nominal luminosity soon. The luminosity will further be increased by a factor of five to seven during the third long shutdown (LS3) scheduled around 2024. The significant increase in luminosity along with the limitations of the current Tracker require a complete renewal of the CMS Outer Tracker, the Tracker Phase-2 Upgrade, during the LS3. New types of modules called PS and 2S modules are foreseen offering enhanced functionality and radiation hardness. Milestones in sensor RD for the 2S modules as well as first characterization results are presented. AC-coupled silicon strip sensors of two vendors, produced on 6-inch as well as on 8-inch wafers, are considered which both feature the demanded n-in-p technology. Global as well as single strip parameters were measured providing insights into the quality of the sensors. AbstractThe LHC at CERN will reach its nominal luminosity soon. The luminosity will further be increased by a factor of five to seven during the third long shutdown (LS3) scheduled around 2024. The significant increase in luminosity along with the limitations of the current Tracker require a complete renewal of the CMS Outer Tracker, the Tracker Phase-2 Upgrade, during the LS3. New types of modules called PS and 2S modules are foreseen offering enhanced functionality and radiation hardness. Milestones in sensor R&D for the 2S modules as well as first characterization results are presented. AC-coupled silicon strip sensors of two vendors, produced on 6-inch as well as on 8-inch wafers, are considered which both feature the demanded n-in-p technology. Global as well as single strip parameters were measured providing insights into the quality of the sensors.

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“…The 2S-Module combines two identical silicon strip sensors with 90 µm × 5 cm strips [4,5] and has sensor spacings of 1.8 mm or 4 mm. For this module the foreseen readout chip is the CMS Binary Chip (CBC) and the strips are AC-coupled to the chip via the wire bonding technique.…”

Section: Ps Module 2s Modulementioning

confidence: 99%

PS-module prototypes with MPA-light readout chip for the CMS Tracker Phase 2 Upgrade

Großmann¹

2017

J. Inst.

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During the HL-LHC era an instantaneous luminosity of 5 × 10 34 cm −2 s −1 will be reached and possibly 3000 fb −1 integrated luminosity will be delivered. This results in the requirement for a major upgrade of the CMS Outer Tracker detector. This contribution briefly reviews the module types and the front end readout electronics foreseen in the preparation program known as phase 2 upgrade. R&D towards the construction of full module prototypes for the Pixel-Strip (PS) module is ongoing. The module combines a macro-pixel sensor and a strip sensor and has p T-discrimination capability at module level. The current experience from module construction with a demonstrator assembly and initial laboratory testing with an alternative module concept for the PS-module is shown. A possible calibration method is introduced.

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Silicon sensor prototypes for the Phase II upgrade of the CMS tracker

Cited by 4 publications

References 3 publications

Front-side biasing of n-in-p silicon strip detectors

Front-side biasing of n-in-p silicon strip detectors

Exploring the quality of latest sensor prototypes for the CMS Tracker Phase II Upgrade

PS-module prototypes with MPA-light readout chip for the CMS Tracker Phase 2 Upgrade

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