Silver Migration and Printed Wiring

Chaikin, Saul W.; Janney, J.; Church, Franklin; McClelland, Charles

doi:10.1021/ie51394a041

Cited by 38 publications

(19 citation statements)

References 2 publications

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“…Chaikin et al 151 demonstrated that, when an alternating 60 Hz voltage was applied between the circuits, far less ECM of Ag was produced, and no ECM of Ag could be detected at higher frequencies. Therefore, the AC could also be expected to inhibit the ECM of Sn and Sn solder alloys.…”

Section: 158mentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: 158mentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…Both Ag and Cu corrode [16] in the presence of sulfur-containing species in the atmosphere, such as H 2 S, SO 2 , and organic acids containing sulfur, resulting in copper sulfide (Cu 2 S) and silver sulfide (Ag 2 S) [1]. Electronic equipment with IAg exposed to high sulfur environments deployed worldwide have shown to corrode rapidly [4,6,7].…”

Section: D1 Immersion Silver Finishmentioning

confidence: 99%

Corrosion of Electronics: Lead‐Free Initiatives

Reid

Garfias-Mesias²

2011

Uhlig's Corrosion Handbook

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“…The dissolution and precipitation was observed on all the biased tracks and it was concluded that the bias condition was unfavourable for the dendrite formation. Another study of silver migration conducted under similar climatic conditions [19] indicated effect of AC frequency on ECM. The formation of deposits similar to initiation of dendrite growth was detected at 60 Hz, however it was not observable with an increase of frequency to 400 Hz.…”

Section: Introductionmentioning

confidence: 99%

Effect of pulsed voltage on electrochemical migration of tin in electronics

Verdingovas

Jellesen

Ambat

2015

J Mater Sci: Mater Electron

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The effect of pulsed voltage on electrochemical migration of tin was studied on size 0805 surface mount capacitors. The study was performed under water droplet condition using 0.0156 and 0.156 g L -1 concentrations of NaCl. The amplitude and the offset of rectangular shape pulse were fixed respectively at 10 and 5 V, while the duty cycle and the pulse width were varied in the range of ms. The results showed that varying of pulse width at fixed duty cycle has a minor effect under investigated conditions, whereas increasing duty cycle significantly reduces the time to short due to dendrite formation and increases the charge transferred between the electrodes over time. With increase of duty cycle, increases the anodic dissolution of tin, which was visualized using a tin ion indicator applied on the components prior to applying the voltage. The anodic dissolution of tin significantly influences the dendritic growth, although a tendency for more hydroxide precipitation was observed for lower duty cycles. The precipitation of tin hydroxides was identified as influencing factor for the reduction of charge transfer under pulsed voltage with low duty cycles, therefore resulting in the suppression of dendrite growth.

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Silver Migration and Printed Wiring

Cited by 38 publications

References 2 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Corrosion of Electronics: Lead‐Free Initiatives

Effect of pulsed voltage on electrochemical migration of tin in electronics

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