Simple, inexpensive, and reliable, high density interconnect technology for flexible electronics applications

Bhattacharya, Sourin; Marinov, V.

doi:10.1109/fedc.2009.5069277

Cited by 5 publications

(4 citation statements)

References 4 publications

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“…Direct-write methods are suitable for lower scale (i.e., from 1 Jlm to 100 Jlm) ranges at the cost of low throughput and high production cost. Bhattacharya et al proposed a modified mill and fill (M&F) interconnect technology for high-resolution, high-throughput, and high-density conductive trace patterns on flexible substrates [ 84 ]. Different topologies are used as interconnect structures such as serpentine, buckled geometry, honeycomb structure, etc.…”

Section: Flexible Interconnectsmentioning

confidence: 99%

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

2023

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Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.

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Section: Flexible Interconnectsmentioning

confidence: 99%

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

2023

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“…made to restrict the scope of this review to the generation of electrically significant components on 3D substrates with no damage to the substrate. For example, sensors or electrical components in metallic parts [13,16,[26][27][28][29][30][31][32][33][34][35]. Some technologies are included which may be of use in relatively large scale deposition of a desired set of materials, though these may require some finishing processes.…”

Section: Sshang Phd Thesis Page 20mentioning

confidence: 99%

“…Other potential industrial uses of this technology cover applications in solar cells [5], Radio Frequency Identification-tags (RFID-tags) [6], flexible-electronics [7,28,30], Organic Light Emitting Diodes (OLED) displays, antenna, biological uses and many more [2,35,141,142].…”

Section: Sshang Phd Thesis Page 31mentioning

confidence: 99%

See 1 more Smart Citation

A predictive thermal dynamic model for parameter generation in the laser assisted direct write process

Shang¹,

Fearon²,

Wellburn³

et al. 2011

J. Phys. D: Appl. Phys.

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Declaration I hereby declare that this submission is my own work and that, to the best of my knowledge and belief, it contains no material previously published or written by another person nor material which to a substantial extent has been accepted for the award of any other degree or diploma of the University or other institute of higher learning, except where due acknowledgment has been made in the text: Signature Name: Shuo Shang Date: Friday 17 th August 2012 .

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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Dahiya,

Christou,

et al. 2024

Adv Materials Technologies

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Heterogeneous integration on flexible substrates has been explored in recent years to meet the high‐performance and flexible form factors requirements of several emerging applications. Reliable interconnects, in both 2D and 3D layouts, are critical for the effective use of these systems. But it is challenging to employ conventional bonding and interconnect technology due to considerable mismatches in mechanical and thermal properties. For example, the ultra‐thin chips (UTCs) are too fragile to withstand the static or oscillating forces applied during conventional bonding. In this regard, printing of metal tracks on flexible substrates is a promising alternative to access the contact pads on integrated circuits (ICs), as the interconnects on diverse substrates can be realized at room temperature processing using as much materials as needed. Further, it is easier to attain step coverage. Considering the above attractive features, and the challenges associated with conventional bonding techniques, this article focuses on the development of high‐resolution printing interconnects in both 2D and 3D layouts and explores various printing routes available for high density integration. The article also discusses major conventional interposers/interconnects forming methods and their limitations for flexible hybrid electronics along with few examples of printed interconnects to highlight the opportunities for future.

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Simple, inexpensive, and reliable, high density interconnect technology for flexible electronics applications

Cited by 5 publications

References 4 publications

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

A predictive thermal dynamic model for parameter generation in the laser assisted direct write process

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

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