2017
DOI: 10.1016/j.solener.2017.10.019
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Simulating and analyzing the thermal cycle behaviors of conductive film bonding PV module

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Cited by 3 publications
(1 citation statement)
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“…Previous researchers have been focused on the reliability of PV module [3,4] , encapsulation material [5,6] and manufacturing process [7,8] about TC aging, but omitted the monitor current impact on PV module. This paper studies the influence of monitor current in the TC test on three types of PV modules (PERC, HJT and TOPCon).…”
Section: Introductionmentioning
confidence: 99%
“…Previous researchers have been focused on the reliability of PV module [3,4] , encapsulation material [5,6] and manufacturing process [7,8] about TC aging, but omitted the monitor current impact on PV module. This paper studies the influence of monitor current in the TC test on three types of PV modules (PERC, HJT and TOPCon).…”
Section: Introductionmentioning
confidence: 99%