Simulation Improved Testing of Fan-out Packaging

Hsiao, Chun-Wei; Lee, Shang; Huang, S. Z.; Wang, Chiyu; Wu, Brain; Wu, Mei-Ling

doi:10.1109/itherm.2018.8419579

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2018

DOI: 10.1109/itherm.2018.8419579

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Simulation Improved Testing of Fan-out Packaging

Chun-Wei Hsiao

Shang Lee

S. Z. Huang

et al.

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Simulation Improved Testing of Fan-out Packaging

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