Simulation of metal microcomponents picking up by electrochemical based on ABAQUS

Abstract

The development of micromanipulation technology has an important impact on the research in the microfield, which mainly focuses on the preparation and assembly of microcomponents, in which the microcomponent picking technology is used. The existing picking methods mainly use manipulation tools to clamp or adsorb components, which may destroy or fail to pick objects in the process of manipulation, and the efficiency is relatively low. In order to solve the problems in the existing manipulation methods, a new metal microcomponent picking method based on electrochemistry is proposed, which mainly uses the electrochemical principle to produce metal deposition, connect the manipulation tool and the object, and indirectly control the object by moving the manipulation tool. In this paper, the simulation software ABAQUS is used to pick up the microcopper wires with the length of 100, 200 and 300 [Formula: see text]m by using a pipette with a nozzle diameter of 15 [Formula: see text]m. The force curve between the tool and the object during the manipulation process is obtained. The feasibility of the method is verified by theoretical analysis and simulation experiments.

Study of Microscale Meniscus Confined Electrodeposition Based on COMSOL

“…The traditional method of picking up microcomponents with a mechanical manipulation tool can easily cause irreversible damage to the object [18,19]. We proposed a reliable and non-destructive manipulation method for metal micro-components based on electrochemistry [20,21]. However, while picking up by electrochemistry, deposition first occurs in the meniscus area between the manipulating tool and the object.…”