Single-mode board-level interconnects for silicon photonics

Brusberg, Lars; Manessis, D.; Herbst, Christian; Neitz, Marcel; Schild, Beatrice; Topper, Michael J.; Schröder, Henning; Tekin, Tolga

doi:10.1364/ofc.2015.w2a.56

Cited by 5 publications

(3 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…20 Based on this, the size of the processable panel was increased to 457 mm × 305 mm. 18 In 2015, graded-index high-bandwidth single-mode waveguides were shown using this process for the first time 21 and most recently 2-m-long spiral-shaped waveguides were demonstrated. 22 Commercially available D 263 ® T eco with a thickness of 550 μm was used for the latter.…”

Section: Glass Integrated Waveguidesmentioning

confidence: 99%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

Self Cite

View full text Add to dashboard Cite

Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems for communication, computing, medical, and sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, and optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, and micro-lenses. Such glassbased substrates can be thin glass layers on large panels or more mini-bench-like boards that can be embedded into organic printed circuit boards (PCBs). Optical fiber interconnects, connectors, and electrical-optical integration platforms are used for higher level system integration and need to be miniaturized on module and board level to fulfill decreasing channel pitch requirements. We provide background on and discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, the related high precision assembly techniques, and advanced fiber interconnects. Some examples of PCB photonic integration, micro-bench optical sub-assemblies, including PIC, and 3D optical resonator packages that combine most of these approaches will be shown. © The Authors.Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

show abstract

Section: Glass Integrated Waveguidesmentioning

confidence: 99%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

Self Cite

View full text Add to dashboard Cite

show abstract

“…An optical interconnection technology for 1310/1550nm has been successfully developed with integrated single-mode glass waveguides panels which having waveguide propagation loss of 0.05 dB/cm. The glass has been integrated into a multi-layer electrical printed circuit board for silicon photonic assembly [2].…”

Section: Introductionmentioning

confidence: 99%

“…The mirror element (I) provides a ditch to bring the spherical mirrors closer to the optical glass edge(2).…”

mentioning

confidence: 99%