Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensors

Billore, Justine; Hascoët, Stanislas; Robutel, Rémi; Buttay, Cyril; Li, Jian Feng

doi:10.1109/tcpmt.2016.2628874

Cited by 4 publications

(1 citation statement)

References 16 publications

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“…The reason that the electro-mechanical coupling of the whole ultrasonic transducer is poor is due to the porosity of the silver layer and/or the PZT ceramic element, which leads to variations in the thickness of the ceramic disk–electrode joint. Therefore, when operating in a wide range of temperatures, this bond can be easily destroyed due to different deformations in individual parts of ultrasonic transducers caused by thermal expansion [ 4 , 8 , 9 , 10 ]. When comparing different types of piezoelectric materials (lead zirconate titanate, lithium niobate, bismuth titanate, gallium orthophosphate, aluminum nitride, etc.)…”

Section: Introductionmentioning

confidence: 99%

Development and Investigation of High-Temperature Ultrasonic Measurement Transducers Resistant to Multiple Heating–Cooling Cycles

Vaškelienė

Šliteris

Kažys

et al. 2023

Sensors

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Usually for non-destructive testing at high temperatures, ultrasonic transducers made of PZT and silver electrodes are used, but this could lead to damage to or malfunction of the ultrasonic transducer due to poor adhesion between PZT and silver. Soldering is one of the most common types of bonding used for individual parts of ultrasonic transducers (protector, backing, matching layer, etc.), but silver should be protected using additional metal layers (copper) due to its solubility in solder. A mathematical modelling could help to predict if an ultrasonic transducer was manufactured well and if it could operate up to 225 °C. The observed von Mises stresses were very high and concentrated in metal layers (silver and copper), which could lead to disbonding under long-term cyclic temperature loads. This paper presents a multilayer ultrasonic transducer (PZT, silver electrodes, copper layers, backing), which was heated evenly from room temperature to 225 °C and then cooled down. In the B-scan, it was observed that the amplitude of the reflected signal from the bottom of the sample decreased with an increase in temperature. However, after six heating–cooling cycles, the results repeated themselves and no signs of fatigue were noticed. This ultrasonic transducer was well manufactured and could be used for non-destructive testing when the environment temperature changes in cycles up to 225 °C.

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Section: Introductionmentioning

confidence: 99%