Abstract:The utilization of System on Chips (SoCs) for shortliving consumer applications has become very popular over the last decades. Because of that, more and more effort has been put into the physical design of SoCs and especially into the so-called macro placement step in order to keep the final price suitable for mass production. How to guarantee that the SoC is realized based on a minimal die area remains a challenging task. Current state-of-the-art solutions for this macro placement-problem mostly try to tackle… Show more
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