Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

Shen, Chaobo; Zhao, Cong; Hai, Zhou; Zhang, Jiawei; Bozack, Michael J.; Suhling, Jeffrey C.; Evans, John L.

doi:10.4071/isom-2015-tp52

Cited by 2 publications

(1 citation statement)

References 5 publications

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“…In my previous work about the 15 mm (0.8 mm pitch) package, the crack is always happened at both sides. The Weibull analysis solution gives the conclusion that board side surface finish ENIG performance better than ENEPIG [ 25 ]. However, after the above failure analysis, we find that, for the 10 mm (0.4 mm pitch) package, cracks normally happened at the package side, not the board side.…”

Section: Resultsmentioning

confidence: 99%

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

et al. 2017

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This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints finished with ENIG and ENEPIG on the board side and ENIG on the package side compared with ImAg plating on both sides. The resulting degradation data suggests that the main concern for 0.4 mm pitch 10 mm package size BGA is package side surface finish, not board side. That is, ENIG performs better than immersion Ag for applications involving long-term isothermal aging. SAC305, with a higher relative fraction of Ag3Sn IMC within the solder, performs better than SAC105. SEM and polarized light microscope analysis show cracks propagated from the corners to the center or even to solder bulk, which eventually causes fatigue failure. Three factors are discussed: IMC, grain structure, and Ag3Sn particle. The continuous growth of Cu-Sn intermetallic compounds (IMC) and grains increase the risk of failure, while Ag3Sn particles seem helpful in blocking the crack propagation.

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Section: Resultsmentioning

confidence: 99%

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

et al. 2017

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Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Azizsoltani

Haldar

2018

Journal of Electronic Packaging

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A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated as realistically as practicable. Uncertainties in all design variables are quantified using available information. The thermomechanical loading is represented by five design parameters and uncertainties associated with them are incorporated. Since the performance or limit state function (LSF) of such complicated problem is implicit in nature, it is approximately generated explicitly in the failure region with the help of a completely improved response surface method (RSM)-based approach and the universal Kriging method (KM). The response surface (RS) is generated by conducting as few deterministic nonlinear finite element analyses as possible by integrating several advanced factorial mathematical concepts producing compounding beneficial effect. The accuracy, efficiency, and application potential of the procedure are established with the help of Monte Carlo simulation (MCS) and the results from laboratory investigation reported in the literature. The study conclusively verified the proposed method. Similar studies can be conducted to fill the knowledge gap for cases where the available analytical and experimental studies are limited or extend the information to cases where reliability information is unavailable. The study showcased how reliability information can be extracted with the help of multiple deterministic analyses. The authors believe that they proposed an alternative to the classical MCS technique.

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Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

Cited by 2 publications

References 5 publications

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

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