Soft solder die attach in small outline discrete packages for both reliability and cost breakthrough

Amiruddin, Mohd Syahril; Tan, C. E.; Dhanapalan, P.

doi:10.1109/eptc.2009.5416449

Cited by 3 publications

(1 citation statement)

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“…Therefore, soft solder bond line thickness (BLT) needs to be thicker and even in order to allo cate so me amount of solder material for intermetallic formation with die backside metallization and lead frame [2]. Controlling die tilt to achieve even and thicker BLT becomes important for improving reliability of solder joint.…”

Section: Introductionmentioning

confidence: 99%

Creep properties of soft solder die attach with Ni balls in power package applications

Tay³

et al. 2012

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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Soft solder die attach is a widely used process for power and high-reliability automotive devices because soft solder has excellent heat-dissipation properties and outstanding robustness against delamination compared to traditional epoxy die attach. However, die tilt is usually one of the important issues and challenges during the soft solder process. The soft solder with Ni balls was introduced to reduce and control die tilt. During solder process, the Ni balls will not melt and will keep the ball shape, which would help control bond line thickness (BLT). The creep fatigue failure is one typical failure mechanism for solder material under thermal cycling. So it is essential to investigate the effect of Ni ball on the material properties and reliability of the solder joint layer. In this work, tensile creep tests for solder wire with and without Ni ballss have been conducted at various temperatures and stress levels using Dynamic Mechanical Analyzer (DMA) to obtain the creep properties of the solders. The steady-state creep strain rates are similar for both solder typesl, which means that the Ni ball addition does not affect the creep behaviour of soft solder significantly. Creep constitutive models were developed and the material constants of the model were determined based on experimental results for both solders. The creep constitutive models can be implemented in finite element analysis (FE A) to investigate the creep behavior of solder in the power packages for evaluation of package reliability. = 8.0 4 x 105 [sinh(0.0 5 2(J )p58 ex p ( _ 7 � 0 )In above equations, Be is the steady-state creep strain rate, (J is the applied stress, and T is the absolute temperature. In the subsequent section, the thermal cycling finite element simulation for power package was conducted by applying these creep models for solder die attach material.

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Section: Introductionmentioning

confidence: 99%

Creep properties of soft solder die attach with Ni balls in power package applications

Tay³

et al. 2012

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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Study on creep fatigue behaviour of soft solders die attach for power package applications

Tay³

et al. 2012

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

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Thermo-Mechanical Analysis and Design for SOD Package Based on Finite Element Method

Shi

Chen

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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Soft solder die attach in small outline discrete packages for both reliability and cost breakthrough

Cited by 3 publications

References 0 publications

Creep properties of soft solder die attach with Ni balls in power package applications

Creep properties of soft solder die attach with Ni balls in power package applications

Study on creep fatigue behaviour of soft solders die attach for power package applications

Thermo-Mechanical Analysis and Design for SOD Package Based on Finite Element Method

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