Abstract:In this paper, we are proposing a hybrid integration platform, on which a single-mode lensed fiber can be actively aligned to a semiconductor laser, and then solder-attached to the platform with the help of on-board thin-film heaters. We have demonstrated 50% coupling efficiency with conically lensed single-mode fibers, bonded with gold-tin (AuSn) eutectic solder. The loss of alignment due to solder solidification has been carefully measured and compensated during the subsequent correctional alignment step tak… Show more
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