Solder Joint Electromigration Mechanisms

Abstract

Electromigation behavior of solder joints with thick Cu column was studied. The failure mechanisms for both SnPb and SnAg solder joints were discussed. To better understand the mechanisms, voids nucleation and propagation were also studied through Kelvin structure resistant monitoring and cross-sectional in-situ SEM observation. It was observed that package substrate process may play a role on how much portion of the life time that void nucleation and propagation could take respectively. Package warpage also played an important role on electromigration performance.

Package reliability and performance trends in an era of product integration

“…Although not reflected in the standards, metrics that leverage numerical simulation and data correlation are commonly used for reliability estimates and risk decisions [5,6]. Other chippackage interaction has been noted is bump-electromigration (EM) [7] where mechanical stress from the package impacts the bump EM result. The use of TSV (Through Silicon Via) for die and die-package interconnections will drive innovation in modeling and reliability analyses.…”