2006 7th International Conference on Electronic Packaging Technology 2006
DOI: 10.1109/icept.2006.359816
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Solder Joint Thermal Fatigue Analysis of 48-FBGA

Song Chen
1
,
Taekoo Lee
2
,
Jaisun Lee
3
et al.
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Cited by 6 publications
(1 citation statement)
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“…In the ANSYS calculation, an element table manipulation is used to generate the energy density in the post processing stage [10][11][12]. Since the solder under lead is very thin, the whole solder layer is selected to predict fatigue life.…”
Section: Resultsmentioning
confidence: 99%

Investigation of thin small outline package (TSOP) solder joint crack after accelerated thermal cycling testing

Lu
1
,
Huang
2
,
Wu
3
et al. 2009
2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging
4
0
0
0
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“…In the ANSYS calculation, an element table manipulation is used to generate the energy density in the post processing stage [10][11][12]. Since the solder under lead is very thin, the whole solder layer is selected to predict fatigue life.…”
Section: Resultsmentioning
confidence: 99%

Investigation of thin small outline package (TSOP) solder joint crack after accelerated thermal cycling testing

Lu
1
,
Huang
2
,
Wu
3
et al. 2009
2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging
4
0
0
0
View full textAdd to dashboardCite
show abstract

Reliability behavior of lead-free solder joints in electronic components

Zhang
1
,
Han
2
,
He
3
et al. 2012
J Mater Sci: Mater Electron
60
0
16
0
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Effect and experiment of screw locations on BGA viscoplastic fatigue life

Tian
1
,
Rongcheng
2
2014
2014 15th International Conference on Electronic Packaging Technology
1
0
2
0
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