Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid

Abstract

The effect of surface modification on the tensile strength of the bonded interface of Al alloy and SUS304 stainless steel was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 20 s and 99.7% Acetic acid for 60 s. Bonding was performed at bonding temperature of 753 ~ 813 K under a pressure of 6 MPa (bonding time of 1.8 ks). As a result of surface modification, bonded joints were obtained at a bonding temperature 20 K lower than that required for non-modified surfaces, and the bonded strength was comparable to that of the maximum load.