Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards

Schneider, Andreas; Cross, Simon P.; Wilson, Matthew D.; Veale, Matthew C.; Hart, M.; Seller, P.; Borri, M.; Beckett, Dan; Lipp, J.

doi:10.23919/empc44848.2019.8951835

2019 22nd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2019

DOI: 10.23919/empc44848.2019.8951835

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Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards

Andreas Schneider

Simon P. Cross

Matthew D. Wilson

et al.

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Cited by 2 publications

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Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards

Cited by 2 publications

References 7 publications

A Study on Fine-Pitch Convertors for Radiation Detectors with Interposers as an Alternative to Through Silicon Via Technology

A Study on Fine-Pitch Convertors for Radiation Detectors with Interposers as an Alternative to Through Silicon Via Technology

Thin Si Sensors on Flexible Printed Circuits – Study of Two Bond Methods

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