2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2019
DOI: 10.1109/itherm.2019.8757461
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Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique

Pradeep Lall1,
Madhu Kasturi2,
Jeff Suhling3
et al.
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Cited by 8 publications
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References 14 publications
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Effect of Long Term Isothermal Exposure on Underfill Material Properties

Lall
1
,
Kasturi
2
,
Wu
3
et al. 2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
11
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1
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Effect of Long Term Isothermal Exposure on Underfill Material Properties

Lall
1
,
Kasturi
2
,
Wu
3
et al. 2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
11
0
1
0
View full textAdd to dashboardCite

Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature

Lall
1
,
Kasturi
2
,
Wu
3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
7
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Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications

Lall
1
,
Kasturi
2
,
Suhling
3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
4
0
0
0
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