2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00108
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Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability

Byoungdo Lee,
Jinwoo Choi,
Sangyong Lee
et al.
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