Structure Transition Mechanism in Undercooled CuNi Alloys

Abstract

Taking a Cu55Ni45 alloy as experimental alloy systems, we systematically studied the method of obtaining deep undercooling of alloy melt. Stable deep undercooling of alloy melt was obtained by the combination of molten glass purification and cyclic overheating. Combined with the nucleation and growth mechanism of undercooled melt, the microstructure evolution and grain refinement mechanism of the alloy were systematically studied in a wide undercooling range. The grain refinement solidification structure under large undercooling was analyzed by EBSD technology. Combined with the typical characteristics of recrystallization in metallographic pictures, it was finally confirmed that the grain refinement was caused by recrystallization.

75‐4: Research on Surface Protective Layer of Cu Pad to Improve Welding Capability for MLED

“…Intermetallic Compound (IMC) [1][2] which means because of atom migration and interaction forms a layer of alloy-like "compound" between the contact interface of different metals. It refers to copper-tin, gold-tin, nickel-tin and silver-tin compounds in welding field.…”