2009
DOI: 10.1149/1.3096508
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Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process

Abstract: In advance Cu BEOL process, Encore Ta/TaN deposition process is widely used for barrier layer deposition to achieve lower via resistance and better electro migration and stress migration performance. However, wafer micro arcing existed frequently due to complex chamber design and DC

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