Studies on the quantitative analysis of an electrochemical solution via the Schlieren method

Abstract

A quantitative schlieren technique has been applied to measure the change of copper sulfate concentration in an electrochemical cell during the copper electroplating process. We constructed a mathematical model that correlates the grayscale values of schlieren images with the concentration of copper sulfate and analyzed the impact of refraction, reflection, and absorption of light during its passage through the solution on the precision of a schlieren quantitative analysis. Ultimately, by examining the temporal and spatial changes in the distribution of the copper sulfate concentration, we ascertained the impacts of convection, diffusion, and electromigration on the concentration distribution. The impact of the current studies would be greatly expanded in important electrochemical practices such as renewable energy conversions and rechargeable batteries.