2008 58th Electronic Components and Technology Conference 2008
DOI: 10.1109/ectc.2008.4550264
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Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Hwa–Young Son
1
,
Il-Ho Kim
2
,
Jinhyoung Park
3
et al.

Abstract: A thick Cu column based double-

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