2005
DOI: 10.1016/j.surfcoat.2004.09.011
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Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film

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Cited by 44 publications
(25 citation statements)
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“…As a result of these processes, the morphology of the deposit is modified, as can be seen later in Section 3.2. The latter effect was observed during lead [9] and copper [10] electrodeposition from an alkaline plating bath in the presence of sorbitol, when inhibition of crystallite growth took place. These results are very significant since the presence of sorbitol in the deposition bath may lead to a better quality tin deposit than in its absence.…”
Section: Resultsmentioning
confidence: 99%
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“…As a result of these processes, the morphology of the deposit is modified, as can be seen later in Section 3.2. The latter effect was observed during lead [9] and copper [10] electrodeposition from an alkaline plating bath in the presence of sorbitol, when inhibition of crystallite growth took place. These results are very significant since the presence of sorbitol in the deposition bath may lead to a better quality tin deposit than in its absence.…”
Section: Resultsmentioning
confidence: 99%
“…Previous studies in our laboratory on lead, copper, copper-zinc and copper-tin deposition processes showed that sorbitol has brightening and leveling characteristics [9][10][11][12]. Encouraged by these findings we evaluated and analyzed the effect of sorbitol on the deposition process and morphology of the tin films.…”
Section: Introductionmentioning
confidence: 98%
“…Rotating disk electrode experiments show that Cu deposits under mass transfercontrolled conditions on Mo, whereas In deposits under kinetic control at room temperature. There are a few reports on electrodeposition of Cu/In or In/Cu stacks for the realization of CIS semiconductor compounds [83,84] . One technologically interesting report from Penndorf et al .…”
Section: Cu(inga)se 2 Via Stacked Metal Layersmentioning
confidence: 99%
“…The basic Cu plating bath was adapted from Barbosa et al . [84] with the addition of a zwitterionic surfactant that reduces grain size and surface roughness [11] . A basic Cu bath is used because the Mo substrate is passivated by a surface oxide in acidic conditions, leading to poorly adherent fi lms.…”
Section: Cu(inga)se 2 Via Stacked Metal Layersmentioning
confidence: 99%
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