Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

Abstract

Chapter 4 IMC growth and kinetics of as-soldered Sn-3.5Ag-0.7Cu-xSb solder joints 4.1 Introduction 4.2 Thermal properties of Sb-containing solder alloys 4.3 Phases formation during liquid-solid reaction in Sb-containing solder joints 4.4 Microstructural Evolution 4.5 Growth kinetics of the IMC formation 4.6 Sb additive effect-Heterogeneous nucleation 4.7 Summary Chapter 5 IMC growth and kinetics in Sn-3.5Ag-0.7Cu-xSb solder joints during ageing IV ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library Table of contents Chapter 6 Effect of Sb composition and Testing Parameters on Tensile Strength of Sn-3.5Ag-0.7Cu Solder Alloys and Solder Joints 6.1 Introduction 6.2 Tension properties of Sb-containing solder alloys 6.2.1 Microstructure analysis of tensile testing specimens 6.2.2 Effect of strain rate on the tensile strength of Sb-containing solder alloys... 6.2.3 Effect of temperature on tensile strength 6.2.4 Effect of Sb additives on mechanical strength-solid solution hardening... 6.3 Tension properties of Sb-containing solder joints 6.3.1 Effect of ageing time and Sb composition on tensile strength of Sn-3.5Ag-0.7Cu solder joints 6.3.2 Failure analysis of tensile testing solder joints 6.3.3 Effect of Sb addition on tension strength-particle hardening 6.4 Summary Chapter 7 Rapid Temperature Cycling testing methodology for reliability assessment of solder interconnection 7.1 Introduction 7.2 Thermal distribution of RTC 7.3 Failure analysis of ATC and RTC testing 7.4 Statistical Analysis ofATC and RTC testing 7.5 ATC and RTC numerical analysis 7.5.1 FE simulation 7.5.2 Simulation results and analysis 7.6 Summary Chapter 8 Conclusions and Recommendations 8.1 Conclusions 8.