Study of the intermetallic growth in copper-clad aluminum wires after thermal aging

Gueydan, Antoine; Domengès, B.; Hug, Éric

doi:10.1016/j.intermet.2014.02.007

Cited by 76 publications

(46 citation statements)

References 41 publications

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“…This difference is most pronounced for Cu thicknesses 7 nm and in the high-energy part of the spectrum, in which absorption is due to inter-band electronic transitions ( Figure 1 and Figure S1) and is attributed to partial inter-mixing at the Al j Cu interface because Cu is known to readily alloy with a variety of metals and semiconductors even at low temperature. [38][39][40][41][42] Any such mixed interfacial layer would have unique electronic and optical properties, not accounted for by the optical model. Due to its comparable average reflectance to that of Al films (86 vs. 88 %), the Al j Cu (8 nm) j Al (0.8 nm) electrode was tested as a reflective electrode in a model top-illuminated OPV.…”

Section: Resultsmentioning

confidence: 99%

A Silver‐Free, Reflective Substrate Electrode for Electron Extraction in Top‐Illuminated Organic Photovoltaics

et al. 2015

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The choice of metals suitable as the reflective substrate electrode for top-illuminated organic photovoltaics (OPVs) is extremely limited. Herein, we report a novel substrate electrode for this class of OPV architecture based on an Al | Cu | AlOx triple-layer structure, which offers a reflectivity comparable to that of Al over the wavelength range 400-900 nm, a work function suitable for efficient electron extraction in OPVs and high stability towards oxidation. In addition to demonstrating the advantage of this composite electrode over Al in model top-illuminated OPVs, we also present the results of a photoelectron spectroscopy study, which show that an oxidised 0.8 nm Al layer deposited by thermal evaporation onto an Al | Cu reflective substrate electrode is sufficient to block oxidation of the underlying Cu by air or during deposition of a ZnO1-x electron-transport layer. This is remarkable given that the self-limiting oxide thickness on Al metal is greater than 2 nm.

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Section: Resultsmentioning

confidence: 99%

A Silver‐Free, Reflective Substrate Electrode for Electron Extraction in Top‐Illuminated Organic Photovoltaics

et al. 2015

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“…The development of the Al 2 Cu 3 phase is likewise. However, this phase is metastable, similarly to the Al 4 Cu 9 [40]. It is likely that the other heat treatment temperature conditions could result in its transformation into a more stable phase with the help of diffusion.…”

Section: Sem Analysesmentioning

confidence: 98%

Fabrication and characterization of cold-swaged multilayered Al–Cu clad composites

et al. 2015

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“…In this stage, δ IMC corresponds to a single layer originated from interdiffusion mechanisms. This can be theoretically described with the traditional Matano-Boltzmann approach for a two-phase system [38,39].…”

Section: Discussion-correlation Between Ultimate Shear Strength Heatmentioning

confidence: 99%

A Correlation between the Ultimate Shear Stress and the Thickness Affected by Intermetallic Compounds in Friction Stir Welding of Dissimilar Aluminum Alloy–Stainless Steel Joints

Picot

Gueydan

Martinez

et al. 2018

Metals

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Abstract:In this work, Friction Stir Welding (FSW) was applied to join a stainless steel 316L and an aluminum alloy 5083. Ranges of rotation and translation speeds of the tool were used to obtain welding samples with different heat input coefficients. Depending on the process parameters, the heat generated by FSW creates thin layers of Al-rich InterMetallic Compound (IMC) mainly composed of FeAl 3 , identified by energy dispersive spectrometry. Traces of Fe 2 Al 5 were also depicted in some samples by X-ray diffraction analysis and transmission electron microscopy. Monotonous tensile tests performed on the weld joint show the existence of a maximum mechanical resistance for a judicious choice of rotation and translation speeds. It can be linked to an affected zone of average thickness of 15 µm which encompass the presence of IMC and the chaotic mixing caused by plastic deformation in this area. A thickness of less than 15 µm is not sufficient to ensure a good mechanical resistance of the joint. For a thickness higher than 15 µm, IMC layers become more brittle and less adhesive due to high residual stresses which induces numerous cracks after cooling. This leads to a progressive decrease of the ultimate shear stress supported by the bond.

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Study of the intermetallic growth in copper-clad aluminum wires after thermal aging

Cited by 76 publications

References 41 publications

A Silver‐Free, Reflective Substrate Electrode for Electron Extraction in Top‐Illuminated Organic Photovoltaics

A Silver‐Free, Reflective Substrate Electrode for Electron Extraction in Top‐Illuminated Organic Photovoltaics

Fabrication and characterization of cold-swaged multilayered Al–Cu clad composites

A Correlation between the Ultimate Shear Stress and the Thickness Affected by Intermetallic Compounds in Friction Stir Welding of Dissimilar Aluminum Alloy–Stainless Steel Joints

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